In order to lay concrete foundation for lead-free solder paste, We are secured advanced techniques from overseas manufacturer and try and test repeatedly before going into lead-free process formally. become a technically independent producer. We are now equipped with the quality of world class supplier and is capable to develop new products to meet needs of our customers.

Features

1. Excellent alloy composition at much lower melting point with better fluidity, better soldering saturation with less blank soldering or false soldering.
2. Excellent thixotrophy resulted to almost bead less
3. Providing excellent soldering effect for 0.2 mm pitch, QFP, 0201 printing
4. Stable long time printing without withered phenomenon.
5. Nitrogen Gas free operation
6. Temperature resistance up to 280℃ with soldering point open for probe testing

Specifications