Product Name：Micro SIM card Conn. SMT, 6/8 Circuits

Part No：SIMMP-00(6/8)01B033-G

                                     (1)  (2)

(1) pin no.

    6 : 6pin              

    8 : 8pin       

(2) Plating:         

     01 : Gold Flash

APPLICATION:

1.        For SIM - Smart Card Use.

Termination Interface: Surface mount

Ports: 1

Durability: 5,000 min

SPECIFICATION:

1.      Contact resistance:

Contact: 50 mΩ typical, 100 mΩ Max.

2.      Insulation resistance: >1000 megaohms / 500 VDC

3.      Operating temperature: -40℃ ~ 85℃

4.      Operating Humidity: 10％~95％RH

5.      Solderability:

Vapor phase: 215℃, 30sec. MAX

IR reflow: 250℃, 10sec. MAX

Manual soldering: 370℃, 3sec. MAX

MATERIAL and FINISH:

1.  Insulation material：High Temperature Plastic (UL 94V-0)

2.  Contact material：Copper Alloy

3.  Finish: Gold plating on contact area

4.  Slide: Thermoplastic, UL 94-V0

Net Weight: 0.5g

Packing:

1.        Tape on reel: 900pcs/reel; 10reels/carton