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  • LAI HENG TECHNOLOGY LTD. - logo
  • LAI HENG TECHNOLOGY LTD.

  • Interconnects Connectors Wire To Board connectors
  • LW-MF300S-XX-S__(I) - 3.0mm Pitch Single Row Wafer,  SMT 180° - LAI HENG TECHNOLOGY LTD.
  • LW-MF300S-XX-S__(I)

    3.0mm Pitch Single Row Wafer, SMT 180°

Specifications

  • 2 ~ 12 circuits available
  • Material: LCP
  • Tin-plated brass pin
  • Mates with LH-MF300M-XX housing
  • Current rating: 5A AC, DC
  • Voltage rating: 250V AC, DC
  • Contact resistance: 10mΩ Max.
  • Dielectric withstanding voltage: 1500V AC/minute
  • Ambient temperature range: -25°C~85°C

Supplier Information

LAI HENG TECHNOLOGY LTD.

TEL : (02)8228-6487 FAX : (02)8228-6486
新北市中和區建八路185號14樓
Web-Site : http://www.laiheng.com.tw/
E-Mail : joeho@aiheng.com.tw
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