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  • LAI HENG TECHNOLOGY LTD. - logo
  • LAI HENG TECHNOLOGY LTD.

  • Interconnects Connectors Wire To Board connectors
  • LW-MF300R-2xXX-P - 3.0mm Pitch Dual Row Wafer ,DIP  90°  With Peg - LAI HENG TECHNOLOGY LTD.
  • LW-MF300R-2xXX-P

    3.0mm Pitch Dual Row Wafer ,DIP 90° With Peg

Specifications

  • 2 ~ 24 circuits available
  • Material: LCP UL 94-V0
  • .0246"(0.625mm) square pins
  • Tin-plated brass pin
  • Mates with LH-MF300M-2xXX housing
  • Standard color: Black
  • Current rating(Wire size/Ampere): #20/5A #22/5A #24/4A #26/3A #28/2A #30/1A
  • Voltage rating: 250V
  • Contact resistance: 10mΩMax.
  • Dielectric strength: 1500V AC/minute
  • Temperature rise: 30°C max. (carry rated current load)

Supplier Information

LAI HENG TECHNOLOGY LTD.

TEL : (02)8228-6487 FAX : (02)8228-6486
新北市中和區建八路185號14樓
Web-Site : http://www.laiheng.com.tw/
E-Mail : joeho@aiheng.com.tw
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