- Interconnects Connectors Wire To Board connectors
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LW-SHD100S-2 x XXGO-SP
1.0mm Pitch Dual Row Wafer, 180° SMT, Gold Plated,With Post
Description
Specifications
Electrical
- Voltage Rating: 50VAC DC
- Current Rating: 1.0A AC DC
- Contact Resistance: Initial value/20mΩ max; After environmental testing/40mΩ max.
- Insulation Resistance: 100MΩ min.
- Temperature Range: -25°C ~ +85°C.
- Withstanding voltage: 500V AC/minute.
Material and Finish
- Header Contact: Phosphor Bronze,
- Wafer: Glass-filled polyamide, UL94V-0.
- Nickel-undercoated, Tin-Plated.
- Color: Natural (Ivory).
- Solder Tad: Brass, Copper-undercoated, Tin-plated.
Supplier Information
LAI HENG TECHNOLOGY LTD.
TEL : (02)8228-6487 FAX : (02)8228-6486新北市中和區建八路185號14樓
Web-Site : http://www.laiheng.com.tw/
E-Mail : joeho@aiheng.com.tw